protect

Kleber

Wir machen vieles unzertrennlich.
Gern auch unsere Geschäftsbeziehungen.

Kleber (Bonding) gibt es, weil alles ausfällt, wenn etwas abfällt – von welchem Bauteil auch immer: Es bedeutet, Bauteile zu befestigen und unter allen Umständen in dieser Position zu halten. Und das bei Materialstärken im Nanometerbereich.

Mit uns stimmt die Chemie: Verlassen Sie sich auf höchste Beratungskompetenz, wenn es um dauerhafte Verbindungen an oder auf der Leiterplatte geht. Setzen Sie auf unsere langjährige Erfahrung, wie flüssig ein Klebstoff sein darf oder muss, ob er leiten oder isolieren soll und ob ein Bauteil damit unterfüllt (Underfill) oder überzogen (Glop-top) werden soll – oder ob man gar hindurchgucken können sollte (Optical Bonding).

Bei dieser Technologie verwischen die Grenzen zwischen Komponentenschutz und Verbindungstechnik. Wie praktisch, dass wir beides gleich gut beherrschen.

Bectron AR 4800 N (Moisture cure)

1-component solvent free resin

based on polyurethane with moderate viscosity with fast cure by accelerated reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron AR 4820 N (Moisture cure)

1-component resin

based on polyurethane with moderate viscosity which cures rapidly by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron AR 4822 N (Moisture cure)

1-component resin

based on polyurethane with moderate viscosity which cures rapidly by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron AR 4824 N (Moisture cure)

1-component solvent free resin

based on polyurethane with high viscosity and fast cure by accelerated reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron AR 4826 N (Moisture cure)

1-component solvent free resin

based on polyurethane with thixotropic rheology and fast cure by accelerated reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron AR 4828 N (Moisture cure)

1-component solvent free resin

based on polyurethane with thixotropic rheology and fast cure by accelerated reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron EP 5502 (Hardener Bectron EH 5908)

2-component epoxy resin

Bectron EP 5502 is an unfilled, ambient temperature curing, solvent free, two-component epoxy resin developed for electronic applications. Bectron EP 5502 satisfies the requirements of the ROHS directive.

Elan-tron MC 62 / W 360

2-component flame retardant epoxy potting compound

Solvent and halogens free. Low viscosity. Good electrical and mechanical properties. High thermal shock resistance. Long pot life. Low exothermic peak. Low shrinkage. To obtain the best mechanical, electrical and chemical properties the post-curing up to 40-50°C is advisable (at least). The system is RoHS compliant (European directive 2002/95/EC)

Bectron PB 3251 (Hardener Bectron PH 4918)

2-component system

to produce a resilient compound suitable for potting and casting. It is based on polybutadiene with polyurethane & filled to provide strength with flexibility at low temperature and superior resistance properties. It is resistant to organic and inorganic solvents with good adhesion. It is solvent free and does not damage components on the board

Bectron PB 3252 (Hardener Bectron PH 4916)

2-component system

which will produce a flexible compound suitable for potting and casting. It is based on polybutadiene and provides good flexibility at low temperature and superior resistance properies. It is resistant to organic and inorganic solvents with good adhesion. It cures with low shrinkage and good adhesion to most substrates. It is solvent free and does not damage components on the board

Bectron PK 4332 (Thermal cure)

1-component resin system

which cures to form a very soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

Bectron PK 4340 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

Bectron PK 4342 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology behaviour

Bectron PK 4344 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

Bectron PK 4353 (Thermal cure)

1-component resin system

which cures to form a semi-flexible polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

Bectron PK 4364 B (Thermal cure)

1-component resin system

which cures to a strong polyurethane duroplastic with some flexibility. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology. Heating the resin re-leases the encapsulated polyisocyanate resulting in a polyaddition reaction to give a resistant duroplastic cured material

Bectron PK 5542 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic with high thermal resistance. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including some thixotropic character while maintaining superior temperature resistance & stability

Bectron PT 4606 (UV cure)

1-component thick film coating

is solvent free, polyurethane based and transparent. It is prepared as thick film coating, cured by UV irradiation and by moisture (in shadow areas). His high viscosity and thixotropic properties allow accurate application to selected areas on the PCB (e.g. suitable for sealing and protection of components or connections on the PCB or like a dam for dam and fill applications)

Bectron PT 4810 N (Moisture cure)

1-component thick film coating

polyurethane with moderate viscosity which cures by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB. It offers excellent flexibility at very low temperature

Bectron PT 4842 (Moisture cure)

1-component thick film coating

low viscosity polyurethane which cures rapidly by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron PT 4840 (Moisture cure)

1-component thick film coating

thixotropic polyurethane which cures rapidly by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB

Bectron PT 4834 (Moisture cure)

1-component thick film coating

polyurethane which cures rapidly by reaction with moisture in the atmosphere to form a soft flexible material suitable for sealing and protection of components and connections on the PCB

Bectron PT 4832 (Moisture cure)

1-component thick film coating

thixotropic polyurethane which cures rapidly by reaction with moisture in the atmosphere to form a soft flexible material suitable for sealing and protection of components and connections on the PCB

Bectron PT 4830 (Moisture cure)

1-component thick film coating

thixotropic polyurethane which cures rapidly by reaction with moisture in the atmosphere to form a soft flexible material suitable for sealing and protection of com- ponents and connections on the PCB

Bectron PT 4814 N (Moisture cure)

1-component thick film coating

polyurethane with low viscosity which cures by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB. It offers excellent flexibility at very low temperature

Bectron PT 4812 N (Moisture cure)

1-component thick film coating

polyurethane with moderate viscosity which cures by reaction with moisture in the atmosphere to form a flexible material suitable for sealing and protection of components and connections on the PCB. It offers excellent flexibility at very low temperature

Bectron PU 4526 (Hardener Bectron PH 4912)

2-component liquid polyurethane system

After curing with the Hardener Bectron® PH 4912 it produces a medium hard moulding compound which meets UL 94 V0 standard of flame resistance

Bectron PU 4535 (Hardener Bectron PH 4902)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a resilient but flexible transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight

Bectron PU 4537 (Hardener Bectron PH 4913)

Tough-elastic polyurethane

produces hard polyurethane casting compound with higher temperature stability than usual polyurethanes and very good electrical insulation properties

Bectron SA 70L1-30 (Electronic 1 part neutral cure)

1 part condensation cure products (Alkoxy)

with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have excellent adhesion to most common substrates used in the electronic industry They are an ideal option for many electronic and lighting applications where high performance is a must

Bectron SA 70P1-15 (Electronic 1 part neutral cure)

1 part condensation cure products (Alkoxy)

with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have excellent adhesion to most common substrates used in the electronic industry

Bectron SA 70P1-30 (Electronic 1 part neutral cure)

1-part condensation cure products (Alkoxy)

thixotropic, non-corrosive when in contact with sensitive electronic parts and substrates. It also provides very good dielectric properties and has excellent adhesion to most common substrates used in the electronic industry

Bectron SA 70P1-34 (Electronic 1 part neutral cure)

1 part condensation cure products (Alkoxy)

with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have excellent adhesion to most common substrates used in the electronic industry

Bectron SA 70P9-37 (Electronic 1 part neutral cure)

1 part condensation cure products (Alkoxy)

with low modulus and non-corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have excellent adhesion to most common substrates used in the electronic industry

Bectron SA 70P9-60 (Electronic 1 part neutral cure)

1-part condensation cure products (Alkoxy)

thixotropic, non-corrosive when in contact with sensitive electronic parts and substrates. It also provides very good dielectric properties and has excellent adhesion to most common substrates used in the electronic industry

Bectron SA 70V1-36 (Electronic 1 part neutral cure)

1 part condensation cure products (Alkoxy)

with sensitive electronic parts. It also provides very good dielectric properties and have excellent adhesion to most common substrates used in the electronic industry

Bectron SA 75L7-70 (Electronic 1 part neutral cure)

Self-bonding 1-part addition cure silicone

that will polymerize to a silicone elasto- mer when exposed to temperatures over 100°C. It provides superior dielectric properties in a very wide temperature range, from -50°C up to 250°C

Elan-Glue EP 5350 (Thermal cure)

1-component solvent free thixotropic formulation

based on epoxy resins and fast thermal cure at low temperature to form a hard material suitable for a wide range of adhesive applications

Elan-glue EP 5610 (UV curing / Thermal cure)

Dual curing low viscos unfilled 1-component formulation

based on epoxy resin. The Elan-glue® EP 5610 is suitable for huge range of adhesive applications. It has an excellent adhe- sion on common substrates

Elan-glue EP 5611 (UV curing / Thermal cure)

Dual curing high viscos filled thixotropic 1-component formulation

based on epoxy resin. The Elan-glue® EP 5611 is suitable for huge range of adhesive applications. It has an excellent adhesion on common substrates

Elan-tron EC 505 (Hardener Elan-tron W 764)

2-component room temperature curing epoxy system

based on a low viscosity unfilled resin and an amine hardener. Solvent free. Low exothermic peak. Low shrinkage. Good adhesion to metals and plastic materials. Good electrical and mechanical properties. Good toughness. Very good thermal shock resistance. The system is RoHS compliant (European directive 2002/95/EC)