Hotmelt moulding

Component protection by WERNER WIRTH:

Hotmelt moulding machines work with lower temperatures and far lower pressures than in normal plastic injection moulding. That is kind to the parts, lets the thermoplastics cure quickly and is relatively cost-effective, without impacting the qualitative attributes of the method. Our hotmelt moulding materials are suitable for connectors, sensors and even whole modules. They withstand both permafrost and average oven temperatures, are resistant to salt and alcohol and can be put into any required shape.

Top quality thermoplastics /hot melt moulding materials for connectors, sensors and whole modules

Finding the right potting material for hotmelt moulding is an art in itself. The short cooling times mean that there are only a few seconds to completely enclose even the most filigree parts without leaving any cavities and to still come out of the machine undistorted. We provide comprehensive advice, take care of tool design and toolmaking and even provide the entire processing technology from tank to extruder, so all you actually need to do is to choose the colour.

The THERMELT product range

Benefit from our comprehensive experience, material know-how and expertise for sustainable component protection, and from the fact that we therefore advocate just one trustworthy, proven partner and his product range: THERMELT.

 

Potting resin based on copolymer polyamides

Thermelt 195 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 195 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_195_black.pdf)

Thermelt 195 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications.THERMELT 195 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_195_natural.pdf)

Thermelt 817 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 817 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_817_black.pdf)

Thermelt 817 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 817 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_817_natural.pdf)

Thermelt 817 R natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 817 R is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_817_R_natural.pdf)

Thermelt 858 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 858 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_858_black.pdf)

Thermelt 861 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 861 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_861_black.pdf)

Thermelt 861 black HV

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 861 HV is exclusively used for molding of electronic/electric components.

PDF Download (WW-Thermelt_861_HV-GB.pdf)

Thermelt 861 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 861 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_861_natural.pdf)

Thermelt 865 black

Copolymer polyamide hot melt resin

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 865 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_865_black.pdf)

Thermelt 865 natural

Copolymer polyamide hot melt resin

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 865 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_865_natural.pdf)

Thermelt 866 black

Copolymer polyamide hot melt resin

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 866 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_866_black.pdf)

Thermelt 866 natural

Copolymer polyamide hot melt resin

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 866 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_866_natural.pdf)

Thermelt 867 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 867 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_867_black_.pdf)

Thermelt 867 blue

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 867 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_867_blue.pdf)

Thermelt 867 grey

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 867 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_867_grey.pdf)

Thermelt 867 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 867 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_867_natural.pdf)

Thermelt 8672 black

non-reactive and solvent free, specially designed for Low Pressure Molding applications. Resin THERMELT 8672 Black is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_8672_black.pdf)

Thermelt 868 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 868 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_868_black.pdf)

Thermelt 868 grey

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 868 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_868_grey.pdf)

Thermelt 868 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 868 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_868_natural.pdf)

Thermelt 868 white

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 868 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_868_white.pdf)

Thermelt 869 grey

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 869 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_869_grey.pdf)

Thermelt 869 blue

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 869 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_869_blue.pdf)

Thermelt 869 black

non reactive and solvent free, specially designed for Low Pressure Molding applications.THERMELT 869 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_869_black.pdf)

Thermelt 869 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 869 is mainly used for molding of electronic/electric components, connectors and cable.

PDF Download (WW-Thermelt_869_natural.pdf)

Thermelt 869 white

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 869 is mainly used for molding of electronic/electric components, connectors and LEDs.

PDF Download (WW-Thermelt_869_white.pdf)

Thermelt 870 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications.THERMELT 870 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_870_natural.pdf)

Thermelt 875 grey

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 875 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_875_grey.pdf)

Thermelt 875 natural

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 875 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_875_natural.pdf)

Thermelt 875 white

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 875 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_875_white.pdf)

Thermelt 892 black

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 892 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_892_black.pdf)

Potting resin based on reactive copolymer polyamides

Thermelt PAR 1000 black

reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT PAR 1000 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_PAR_1000_black.pdf)

Thermelt PAR 1000 natural

reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT PAR 1000 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_PAR_1000_natural.pdf)

Thermelt PAR 1002 black

reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT PAR 1002 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_PAR_1002_black.pdf)

Thermelt PAR 1002 natural

reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT PAR 1002 is mainly used for molding of electronic/electric components, connectors and cables.

PDF Download (WW-Thermelt_PAR_1002_natural.pdf)

Other materials by WERNER WIRTH

Besides thermoplastics for hotmelt moulding, we also offer materials for conformal coating, potting cast resin or bonding adhesives. After all, here at WERNER WIRTH we know what has the desired effect when, how, where and why, and we also know what has to be used when, how, where and why.

Any questions? We are at your service!