Potting

Bectron AP 1104 (low viscosity)

2-component polyurethane and epoxy systems

unfilled, colourless, solvent free accelerator developed for electronic applications.

Bectron® AP 1104 satisfies the requirements of the ROHS directive.

PDF Download (Bectron_AP_1104__GB_.pdf)

Bectron EP 5502 (Hardener Bectron EH 5908)

2-component epoxy system

unfilled, ambient temperature curing, solvent free, two-component epoxy resin developed for electronic applications. Bectron EP 5502 satisfies the requirements of the ROHS directive.

PDF Download (Bectron_EP_5502.pdf)

Bectron EP 5503 (Hardener Bectron EH 5908)

Cold-hardening two-component system free from solvents

suited for moulding of electric machinery and equipment, such as stators, rotors, magnet coils and transformers. The cured moulding compound exhibits very high stability of shape at high temperatures (acc. to Martens), and is therefore preferred for service at elevated operating

temperatures

PDF Download (Bectron_EP_5503.pdf)

Bectron EP 5504 (Hardener Bectron EH 5909)

2-component system free from solvents

in combination with Hardener Bectron® EH 5909, results in hard moulding compounds with self-extinguishing properties (UL 94 V 0), a high thermal con- ductivity and a high permanent temperature resistance (thermal class F – 155 °C).

PDF Download (Bectron_EP_5504.pdf)

Elan-tron MC 62/W 360

2-component flame retardant epoxy potting compound

Two component self-extinguishing filled epoxy system. Solvent and halogens free. Low viscosity. Good electrical and mechanical properties. High thermal shock resistance. Long pot life. Low exothermic peak. Low shrinkage. To obtain the best mechanical, electrical and chemical properties the post-curing up to 40-50°C is advisable (at least). The system is RoHS compliant (European directive 2002/95/EC)

PDF Download (Elan-tron_MC62_W360.pdf)

Bectron MR 3402 (Melting Resin)

1-component hot melt resin

thick film coating developed for electronic applications. It is based on polyolefin resin chemistry which is better suited to electronics than conventional polyamide based hot-melt thermoplastic

PDF Download (Bectron_MR_3402.pdf)

Bectron MR 3404 (Melting Resin)

1-component hot melt resin

thick film coating developed for electronic applications. As a thermoplastic there is no curing reaction only a rapid solidification of the resin on cooling

PDF Download (Bectron_MR_3404__GB_.pdf)

Bectron MR 3406 (Melting Resin)

1-component hot melt resin thick film coating

developed for electronic applications. It is based on polyolefin resin chemistry which is better suited to electronics than conventional polyamide based hotmelt thermoplastic

PDF Download (Bectron_MR_3406.pdf)

Bectron PB 3200 (Hardener Bectron PH 4917)

Polybutadiene Potting/Encapsulation Resin

2 component system to produce a very flexible casting. It is based on polyurethane with

polybutadiene to provide good flexibility at very low temperature and superior resistance properties

PDF Download (Bectron_PB_3200.pdf)

Bectron PB 3201 (Hardener Bectron PH 4918)

Polybutadiene Potting/Encapsulation Resin

2 component system which will produce a flexi- ble compound suitable for potting and casting. It is based on polybutadiene and provides good flexibility at low temperature and superior resistance properties. It is resistant to organic and inorganic solvents with good adhesion. It cures with low shrinkage and good adhesion to most substrates. It is solvent free and does not damage components on the board

PDF Download (Bectron_PB_3201.pdf)

Bectron PB 3231 (Hardener Bectron PH 4918)

Polybutadiene Potting/Encapsulation Resin

2 component system to produce a flexible compound suitable for potting and casting. It is based on polybutadiene and to provide flexibility at very low temperature and superior resistance properties

PDF Download (Bectron_PB_3231.pdf)

Bectron PB 3251 (Hardener Bectron PH 4918)

Polybutadiene Potting/Encapsulation Resin

2 component system to produce a resilient com- pound suitable for potting and casting. It is based on polybutadiene with polyurethane & filled to provide strength with flexibility at low temperature and supe- rior resistance properties. It is resistant to organic and inorganic solvents with good adhesion.

It is solvent free and does not damage components on the board

PDF Download (Bectron_PB_3251.pdf)

Bectron PB 3252 (Hardener Bectron PH 4916)

Polybutadiene Potting/Encapsulation Resin

2 component system which will produce a flexible compound suitable for potting and casting. It is based on polybutadiene and provides good flexibility at low temperature and superior resistance properties. It is resistant to organic and inorganic solvents with good adhesion. It cures with low shrinkage and good adhesion to most substrates. It is solvent free and does not damage components on the board

PDF Download (Bectron_PB_3252.pdf)

Bectron PK 4332 (Thermal cure)

1-component resin system

which cures to form a very soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

PDF Download (Bectron_PK_4332_Schwarz.pdf)

Bectron PK 4340 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

PDF Download (Bectron_PK_4340_Schwarz.pdf)

Bectron PK 4342 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology behaviour

PDF Download (Bectron_PK_4342_Schwarz.pdf)

Bectron PK 4344 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

PDF Download (Bectron_PK_4344_Schwarz.pdf)

Bectron PK 4353 (Thermal cure)

1-component resin system

which cures to form a semi-flexible polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties

PDF Download (Bectron_PK_4353_Blau.pdf)

Bectron PK 4364 B (Thermal cure)

Blue 1-component resin system

which cures to a strong polyurethane duroplastic with some flexibility. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology. Heating the resin releases the encapsulated polyisocyanate resulting in a polyaddition reaction to give a resistant duroplastic cured material

PDF Download (Bectron_PK_4364_B.pdf)

Bectron PK 5542 (Thermal cure)

1-component resin system

which cures to form a soft polyurethane duroplastic with high thermal resistance. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including some thixotropic character while maintaining superior

temperature resistance & stability

PDF Download (Bectron_PK_5542.pdf)

Bectron PT 4606 (UV cure)

1-component thick film coating

solvent free, one-component, polyurethane based and transparent. It is prepared as thick film coating, cured by UV irradiation and by moisture (in shadow areas). His high viscosity and thixotropic properties allow accurate application to selected areas on the PCB (e.g. suitable for sealing and protection of components or connections on the PCB or like a dam for dam and fill applications)

PDF Download (Bectron_PT_4606.pdf)

Bectron PT 4830 (Moisture cure)

1-component thixotropic polyurethane

which cures rapidly by reaction with moisture in the atmosphere to form a soft flexible material suitable for sealing and protection of components and connections on the PCB

PDF Download (Bectron_PT_4830.pdf)

Bectron PT 4832 (Moisture cure)

1-component thixotropic polyurethane

which cures rapidly by reaction with moisture in the atmosphere to form a soft flexible material suitable for sealing and protection of components and connections on the PCB

PDF Download (Bectron_PT_4832.pdf)

Bectron PT 4840 (Moisture cure)

1-component thixotropic polyurethane

which cures rapidly by reaction with moisture in the atmosphere to form a flexible mate- rial suitable for sealing and protection of components and connections on the PCB

PDF Download (Bectron_PT_4840.pdf)

Bectron PU 4501 (Hardener PH 4901)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a very soft transparent elastic polyurethane plastic

Bectron PU 4501 is a solventless clear resin based on polyetherpolyol with no fillers. The associated Hardener Bectron PH 4901 is a mixture of aliphatic isocyanates.

PDF Download (Bectron_PU_4501.pdf)

Bectron PU 4512 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

soft elastic polyurethane with low shrinkage, with excellent insulation properties and provides good mechanical and chemical protection, with enhanced adhesion for difficult surfaces

PDF Download (Bectron_PU_4512.pdf)

Bectron PU 4513 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

soft, elastic polyurethane with low shrinkage, excellent insulation properties and provides good mechanical and chemical protection. It is suitable for potting sensitive components and PCBs

for outdoor applications.

PDF Download (Bectron_PU_4513.pdf)

Bectron PU 4515 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system modified with polybutadiene providing high flexibility and rubber-like properties down to low temperature

PDF Download (Bectron_PU_4515.pdf)

Bectron PU 4516 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

strong polyurethane with low shrinkage, with excellent insulation properties and provides good mechanical and chemical protection. It has excellent adhesion and superior thermal resistance. It is a low viscosity system for ease of potting.

PDF Download (Bectron_PU_4516.pdf)

Bectron PU 4517 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system. After curing with the Hardener Bectron PH 4912 it

produces a tough moulding compound for small electronic and electrical components.

PDF Download (Bectron_PU_4517.pdf)

Bectron PU 4518 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

produces a flexible casting compound with flame retardant properties

PDF Download (Bectron_PU_4518.pdf)

Bectron PU 4519 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

equivalent to the widely used Bectron PU 4513 except for higher viscosity. It is a soft, elastic polyurethane with low shrinkage, with excellent insulation properties and provides good mechanical and chemical protection.

PDF Download (Bectron_PU_4519.pdf)

Bectron PU 4520 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

soft elastic polyurethane with low shrinkage, with excellent insulation properties and

provides good mechanical and chemical protection. The special filler combination contains materials which have low abrasion to minimise damage to parts in automatic potting and dispensing equipment.

PDF Download (Bectron_PU_4520.pdf)

Bectron PU 4522 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system. After curing with the Hardener Bectron PH 4912 it

produces a tough elastic moulding compound which meets UL 94 V0 standard of flame resistance.

PDF Download (Bectron_PU_4522.pdf)

Bectron PU 4524 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system. After curing with the Hardener Bectron PH 4912 it

produces a tough moulding compound for small electronic and electrical components and with good chemical resistance.

PDF Download (Bectron_PU_4524.pdf)

Bectron PU 4526 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system. After curing with the Hardener Bectron PH 4912 it

produces a medium hard moulding compound which meets UL 94 V0 standard of flame resistance.

PDF Download (Bectron_PU_4526.pdf)

Bectron PU 4527 (Hardener PH 4912)

Polyurethane Potting/Encapsulation Resin

provides a high viscosity mixture with flow special thixotropic flow properties to allow precise dispensing particularly for dam & fill applications. The mixture cures to form a fairly hard polyurethane with low shrinkage with excellent insulation properties with mechanical and chemical protection.

PDF Download (Bectron_PU_4527.pdf)

Bectron PU 4532 VP (Hardener PH 4902)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a resilient but flexible transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight.

PDF Download (Bectron_PU_4532.pdf)

Bectron PU 4533 (Hardener PH 4901)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a resilient but flexible transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight.

PDF Download (Bectron_PU_4533_4901.pdf)

Bectron PU 4533 (Hardener PH 4902)

Elastisches, transparentes Polyurethan mit guter UV-Beständigkeit

elastische, transparente Formstoffe mit guter Temperaturwechselbeständigkeit sowie guter Kälteflexibilität

PDF Download (D-Bectron_PU_4533_4902.pdf)

Bectron PU 4534 (Hardener PH 4913)

Polyurethane Potting/Encapsulation Resin

two-component liquid polyurethane system. After curing with the Hardener Bectron PH 4913 it

produces a soft moulding compound which meets UL 94 V0 standard of flame resistance.

PDF Download (Bectron_PU_4534.pdf)

Bectron PU 4535 (Hardener PH 4901)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a resilient but flexible transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight.

PDF Download (Bectron_PU_4535_4901.pdf)

Bectron PU 4535 (Hardener PH 4902)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a resilient but flexible transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight.

PDF Download (Bectron_PU_4535_4902.pdf)

Bectron PU 4536 (Hardener PH 4902)

Polyurethane Potting/Encapsulation Resin

2 part system which is cured to form a hard transparent polyurethane. It is a solvent free system with which is non-yellowing in daylight.

PDF Download (Bectron_PU_4536.pdf)

Bectron PU 4537 (Hardener PH 4913)

Tough-elastic Polyurethane

produces hard polyurethane casting compound with higher temperature stability than usual polyurethanes and very good electrical insulation properties

PDF Download (Bectron_PU_4537.pdf)

Bectron SA 70L1-30

High Performance Silicone Adhesive

1 part condensation cure products (Alkoxy) with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have ex-cellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70L1-30.pdf)

Bectron SA 70P1-15

1 Part Neutral Cure Silicone Adhesive

1 part condensation cure products (Alkoxy) with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have ex-cellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70P1-15.pdf)

Bectron SA 70P1-30

High Performance Silicone Adhesive

1-part condensation cure products (Alkoxy), thixotropic, non-corrosive when in contact with sensitive electronic parts and substrates. It also provides very good dielectric properties and has excellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70P1-30.pdf)

Bectron SA 70P1-34

1 Part Neutral Cure Silicone Adhesive

1 part condensation cure products (Alkoxy) with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have ex-cellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70P1-34.pdf)

Bectron SA 70P9-37

1 Part Neutral Cure Silicone Adhesive

1 part condensation cure products (Alkoxy) with low modulus and non-corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have ex-cellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70P9-37.pdf)

Bectron SA 70P9-60

High Performance Silicone Adhesive

1-part condensation cure products (Alkoxy), thixotropic, non-corrosive when in contact with sensitive electronic parts and substrates. It also provides very good dielectric properties and has excellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70P9-60.pdf)

Bectron SA 70V1-36

High Performance Silicone Adhesive

1 part condensation cure products (Alkoxy) with low modulus and non corrosive when in contact with sensitive electronic parts. It also provides very good dielectric properties and have ex-cellent adhesion to most common substrates used in the electronic industry.

PDF Download (Bectron_SA_70V1-36.pdf)

Bectron SA 75L7-70

1 Part Neutral Cure Silicone Adhesive

a self-bonding 1-part addition cure silicone that will polymerize to a silicone elasto-mer when exposed to temperatures over 100°C. It pro-vides superior dielectric properties in a very wide tem-perature range, from -50°C up to 250°C.

PDF Download (Bectron_SA_75L7-70.pdf)

Bectron SG 75L2-30 / SG 79L5-30

Silicone Gel

specifically designed for protection of electronic components against mechanical stress and vibration when high thermal conductivity is needed. Possibility of accelerated cure at high temperature allows use in mass production manufacturing lines.

PDF Download (Bectron_SG_75L2-30.pdf)

Bectron SG 75V1-15 / SG 79V1-15

Silicone Gel

specifically designed for protection of electronic components against mechanical stress and vibration. Thanks to its high thermal resistance and a low ions content Bectron SG 75V1-15 system is particularly suited for potting semiconductors in power modules.

PDF Download (Bectron_SG_75V1-15.pdf)

Bectron SK 75V1-35 / SH 79V2-35

2 Part Silicone Potting Compound

Thanks to its elastic properties and long term thermal resistance Bectron SK 75V1-35 system is succesfully used for encapsulation of pressure sensitive devices as well as for protection of motor windings in hot air systems.

PDF Download (Bectron_SK_75V1-35.pdf)

Bectron SK 75V2-35 / SH 79V5-35

Electronic 2 Part Silicone Potting Compound

specifically designed for protection of electronic parts and components against high temperatures. Possibility of accelerated cure at high temperatures allows use in mass production manufacturing lines.

PDF Download (Bectron_SK_75V2-35.pdf)

Bectron SK 75V2-45 / SH 79V2-45

Electronic 2 Part Silicone Potting Compound

Thanks to its elastic properties and long-term thermal resistance Bectron SK 75V2-45 system is successfully used for encapsulation of very sensitive electronic circuits and components operating in very high temperatures

PDF Download (Bectron_SK_75V2-45.pdf)

Bectron SK 75V2-65 / SH 79V2-65

Electronic 2 Part Silicone Potting Compound

Thanks to its elastic properties and long-term thermal resistance Bectron SK 75V2-65 system is successfully used for encapsulation of very sensitive electronic circuits and components operating in very high temperatures.

PDF Download (Bectron_SK_75V2-65.pdf)

Bectron SK 76V2-50 / SH 79V5-50

Electronic 2 Part Silicone Potting Compound

successfully used for casting coil heads and other components subject to thermal shock.

Additionally, Bectron SK 76V2-50 is generally suited as a protection for electronic components and circuits such as high-performance semi-conductors and high load resistors

PDF Download (Bectron_SK_76V2-50.pdf)

Bectron SK 76V2-75 / SH 79V5-75

Electronic 2 Part Silicone Potting Compound

successfully used for casting coil heads and other components subject to thermal shock.

Additionally, Bectron SK 76V2-75 is generally suited as a protection for electronic components and circuits such as high-performance semi-conductors and high load resistors

PDF Download (Bectron_SK_76V2-75.pdf)

Elan-tron EC 505 (Hardener Elan-tron W 764.1)

2-component room temperature curing epoxy system

based on a low viscosity unfilled resin and an amine hardener. Solvent free. Low exothermic peak. Low shrinkage. Good adhesion to metals and plastic materials. Good electrical and mechanical properties. Good toughness. Very good thermal shock resistance. The system is RoHS compliant (European directive 2002/95/EC)

PDF Download (Elan-tron_EC505_W764.1_eng.pdf)

Elan-tron PU 4257 LV FR M (Hardener Elan-tron PH 4900)

Hard polyurethane, low viscosity, UL recognized

specially suitable for hand casting of small transformers when self extinguishing properties are required. Long pot life and low working viscosity allow bubble-free potting particularly for hand application. Machine potting is of course also possible

PDF Download (Elan-tron_PU_4257_LV_FR_M.pdf)

Elan-tron PU 4264 FR (Hardener Elan-tron PH 4900)

Semi-rigid polyurethane, UL recognized

liquid solvent free 2 component system. After curing with hardener Elan-tronPH 4900 produces a medium-hard impact resistant compound with flame retardant properties to the UL 94 V0 standard

PDF Download (Elan-tron_PU_4264_FR.pdf)

Elan-tron PU 4310 UVS (Hardener Elan-tron PH 4970 CT)

Elastisches Polyurethan, klar transparent, UV bestaendig

fluessiges, loesungsmittelfreies 2- Komponenten-Systen und ergibt nach Aushaertung einen zaeh-elastischen Formstoff

PDF Download (Elan-tron_PU_4310_UVS_de.pdf)

Bectron SG 75V1-60 / SG 79V1-60

Silicone Gel

specifically designed for protection of electronic components against mechanical stress and

vibration. Thanks to its high thermal resistance and a low ions content Bectron SG 75V1-60 system is particularly suited for potting semiconductors in power modules.

PDF Download (Bectron_SG_75V1-60.pdf)

Bectron SG 75V1-75 / SG 79V1-75

Silicone Gel

specifically designed for protection of electronic components against mechanical stress and vibration. Thanks to its high thermal resistance and a low ions content Bectron® SG 75V1-75 system is particularly suited for potting semiconductors in power modules.

PDF Download (Bectron_SG_75V1-75_GB.pdf)

Bectron AP 74V8-03

General Purpose Primer for Silicone Rubber

enhance adhesion of silicone rubbers to different substrates including most metals, rubber polyester, nylon and other plastics.

PDF Download (Bectron_AP_74V8-03.pdf)