BONDING ADHESIVES

Professional adhesives for bonding parts, metals and other surfaces

Bonding prevents everything from failing just because something has fallen off – no matter which bit is affected. Bonding means fastening parts and keeping them in this position, whatever happens. Even for material thicknesses in the nanometre range. We at WERNER WIRTH like making things inseparable. Including our business relationships.

Advantages/Benefits of Adhesives for Bonding Applications

Adhesives are an effective method for joining, protecting, or sealing parts without the need for mechanical fasteners. The use of adhesives in component protection offers several advantages:

  • Reliable Bonds: Modern adhesives can create strong, permanent connections between a variety of materials, such as plastics.
  • Uniform Stress Distribution: Unlike mechanical joining methods that can create localized stress concentrations, adhesives distribute the load evenly across the entire bonding area. This reduces the risk of material fatigue and/or failure.
  • Protection from Environmental Factors: Adhesives can be used to protect components from dust, moisture, and other environmental factors. Many adhesives are water-resistant and form an effective barrier against oxidation and corrosion.
  • Design Flexibility: Adhesives enable complex designs and the use of lighter or dissimilar materials, as they allow for the joining of parts that would be difficult to connect using traditional methods.
  • Aesthetic Advantages: Since adhesives allow for invisible connections, they can enhance the aesthetic quality of the final product. They avoid the need for welds, screw heads, or other fastening elements that could detract from the appearance.

Overall, adhesives in component protection offer a flexible, reliable, and effective solution for enhancing the performance, durability, and reliability of products across a wide range of applications. These are utilized in the electronics industry, mechanical engineering, the automotive industry, and many other areas.

For permanent connections, for example to and on printed circuit boards

PROTECTION

Whether underfill, glop top or optical bonding: we get the chemistry right.

You can rely on the very best consulting expertise, for example, when it comes to permanent connections to or on printed circuit boards. We offer decades of experience, for example, when it comes to how liquid the adhesive must or may be, whether it should be conductive or insulating and whether it should be applied to the part as underfill or glop top – or whether you should even be able to see through it (optical bonding).

We have the right adhesive for absolutely everything and swear by the Bectron® product range by ELANTAS, from the all-rounder polyurethane via very hard epoxy resins to flexible one- and two component silicones. As versatile super adhesive, we recommend cyanoacrylate in the form of Bostik Born2Bond™.

Please find below just a brief excerpt from our comprehensive range of products. Do contact us to find and obtain the right adhesive for your specific task. Our adhesives keep what we promise. And you can gladly take that literally.

Polyurethane

Flexible all-rounders with good adhesion properties

Polyurethane can be used for many different purposes and is well-known for its universal suitability. From flexible to hard, it adheres well to many substrates and stands out with good to very good resistance to many substances. You can use one- or two-component polyurethane, depending on the circumstances. Modified polyurethane can be cured with UV light.

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Polyurethane one-component adhesives

Product details

One-component polyurethane (1C PUR adhesive) cures to an elastomer by absorbing moisture from the air. 1C PUR adhesive is usually pasty and stable. It is applied with a handgun or processing machine in beads to reach layers of approx. 3 to more than 10 mm thick. WERNER WIRTH also offers solvent-free, UV-curing and heat-curing polyurethane.

One-component

Bectron® AR 4820 N

Bectron® AR 4820 N is a one-component resin on polyurethane basis with medium viscosity that cures rapidly by reacting with moisture in the atmosphere to form a flexible material that is suitable for sealing and protecting parts and connections on the printed circuit board.

Bectron® AR 4820 fulfils the requirements of the ROHS.

Properties:

  • Good electric properties also after immersion in water
  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to low temperatures (-45 °C)
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents

Applications:

  • Bectron® AR 4820 N is used for chemical protection of printed circuit boards from moisture and impurities
  • For protecting large components on the printed circuit board from mechanical jolts and vibrations
  • It is an effective adhesive on most surfaces of printed circuit boards and electronic components
  • Its viscosity makes it suitable for large-surface, selective bonding of individual parts or for sealing open connections on the printed circuit board
  • The applied material remains in place during the process without impacting the sensitive components
  • The cured product is soft and flexible and therefore causes no damage to sensitive parts during temperature shocks, not even at low temperatures

Bectron® PT 4834

Bectron® PT 4834 is a one-component system based on polyurethane that cures quickly in reaction with atmospheric moisture and forms a soft, flexible material. Suitable for sealing and protecting components and connections on the printed circuit board.

Properties:

  • Good electric properties also after immersion in water
  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to low temperatures (-45 °C)
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents
  • Low solvent content
  • Fulfils the ROHS directives

Applications:

  • Chemical protection of PCBs from moisture and impurities and from mechanical jolts and vibrations
  • Its viscosity is suitable for thick-film coating of large surfaces – selectively on individual components – or for sealing open components on the printed circuit board
  • The cured product is soft and flexible and therefore causes no damage to sensitive components under thermal shock, including low temperatures

Bectron® PT 4842

Bectron® PT 4842 is a low-viscosity one-component polyurethane that cures quickly in reaction with atmospheric moisture. It forms a flexible material that is suitable for sealing and protecting parts and connections on the printed circuit board.

Properties:

  • Good electric properties also after immersion in water
  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to low temperatures (-40 °C)
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents
  • Low solvent content
  • Fulfils the ROHS directives
  • Coated area can inspected under UV light

Applications:

  • Bectron® PT 4842 is used for chemical protection of PCBs from moisture and impurities and for protecting large components on the printed circuit board from mechanical jolts and vibrations
  • Its viscosity makes it suitable for thick film coating of large areas selectively on individual components or for sealing open connections on the printed circuit board.
  • The cured product is soft and flexible and therefore causes no damage to sensitive components under thermal shock, including low temperatures

Bectron® PT 4840

Bectron® PT 4840 is a one-component, thixotropic polyurethane that cures in reaction with atmospheric moisture into a soft, flexible material. For sealing and protecting components and connections on the printed circuit board.

Properties:

  • Good electric properties also after immersion in water
  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to low temperatures (-40 °C)
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents
  • Low solvent content
  • Fulfils the ROHS directives
  • Coated area can be inspected under UV light

Applications:

  • Bectron® PT 4840 is used for chemical protection of PCBs from moisture and impurities
  • For protecting large components on the PCB from mechanical jolts and vibrations
  • Its highly viscous, thixotropic flow properties makes it suitable for application to single components or for sealing open connections on the PCB
  • When using the right nozzle diameter, a thin line of Bectron® PT 4840 covers a series of connection pins or other small parts (without previous masking or covering)
  • The applied material remains in place during the process and cures without impacting sensitive parts

Bectron® PT 4830

Bectron® PT 4830 is a one-component, thixotropic polyurethane that cures quickly in reaction with atmospheric moisture into a soft, flexible material. It is suitable for sealing and protecting components and connections on the printed circuit board.

Properties:

  • Good electric properties also after immersion in water
  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to low temperatures (-45 °C)
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents
  • Low solvent content

Applications:

  • Bectron® PT 4830 is used for chemical protection of PCBs from moisture and impurities
  • For protecting large components on the PCB from mechanical jolts and vibrations
  • Its highly viscous, thixotropic flow properties makes it suitable for application to single components or for sealing open connections on the PCB
  • When using the right nozzle diameter, a thin line of Bectron® PT 4830 covers a series of connection pins or other small parts (without previous masking or covering)
  • The applied material remains in place during the process and cures without impacting sensitive parts.

One-component, heat-curing

Bectron® PK 4340

PK 4340 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4340 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.

Properties:

  • The cured material has high elasticity and high strength, resulting in outstanding temperature cycle behaviour in the range from -60 °C to 125 °C.
  • Bectron® PK 4340 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications
  • Bectron® PK 4340 shows good adhesion to almost all materials used in electronics
  • Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond

Applications:

  • In cured state, Bectron® PK 4340 is a soft duroplastic, suitable for vibration protection of sensitive parts
  • Bectron® PK 4340 is therefore ideal for partial or selective coating of SMDs and other component groups on printed circuit boards
  • The rapid increase in viscosity with low shear allows protection of small areas of individual parts
  • When thicker coating is required, Bectron® PK 4340 can be used as dam
  • In the second step, the inner area is filled with a filling material (with lower viscosity, such as PK 4342)

Bectron® PK 4342

Bectron® PK 4342 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4342 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.

Properties:

  • The cured material has high elasticity and high strength, even in temperature cycles in the range from -60 °C to 125 °C.
  • Bectron® PK 4342 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications
  • Bectron® PK 4342 shows good adhesion to almost all materials used in electronics
  • Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond

Applications:

  • In cured state, Bectron® PK 4342 is a soft duroplastic, suitable as protection for sensitive parts
  • Bectron® PK 4342 is therefore ideal for selective coating of SMDs and other component groups on printed circuit boards
  • Also used as potting material for electronic components and sensors and finds wide-spread use in automotive applications
  • Bectron® PK 4342 can be used as filling material in the dam-and-fill process
    (Bectron® PK 4342 acts as dam in the first step of the process)

Bectron® PK 4344

Bectron® PK 4344 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology including excellent thixotropic properties. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4344 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.

Properties:
The cured material has high elasticity and high strength, resulting in outstanding temperature cycle behaviour in the range from -60 °C to +125 °C as well as high vibration strength. This warrants minimum cracking even with thick-film applications. Bectron® PK 4344 has excellent chemical resistance to a large number of aggressive fluids frequently used in the automotive industry. Furthermore, Bectron® PK 4344 shows good adhesion to nearly all materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directives.

Applications:
In cured state, Bectron® PK 4344 is a soft duroplastic suitable for vibration protection of sensitive parts. Bectron® PK 4344 is suitable for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It has low viscosity. In rapid coating, this permits a thinner film than types with higher viscosity. This low viscosity is ideal for minimising air bubbles inclusions in complex potting applications. When used as potting resin, it is suitable for sensors, automotive electronics, connectors etc.

Bectron® PK 4364

Bectron® PK 4364 is a blue one-component resin system that cures to a polyurethane duroplastic with a certain flexibility. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology. Heating the resin releases the encapsulated polyisocyanate again. This triggers a polyaddition reaction that generates a resistant duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4364 B is ready for use. It stands out with outstanding properties and particularly good environmental compatibility.

Properties:
The use of Bectron® PK 4364 B guarantees smooth, homogeneous coating of edges and pins. This coating protects the parts from mechanical damage and offers very good dielectric properties. The cured material has high elasticity and high strength, leading to very good temperature cycle behaviour in the range from -50 °C to +125 °C. This results in minimum cracking, even with thick films. Bectron® PK 4364 B has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 4364 B also shows very good adhesion on most materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directives

Applications:
Bectron® PK 4364 B is used as coating and potting resin for SMT printed circuit boards and ceramic substrates, e.g. sensors.

Bectron® PK 5542

Bectron® PK 5542 is a one-component resin system that cures to a soft polyurethane duroplastic with high heat resistance. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected for controlled rheology including a certain thixotropic character, while offering outstanding heat resistance and stability. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a soft cured duroplastic material.

Properties:
The cured material has high elasticity and high strength. Bectron® PK 5542 is suitable for temperatures of up to 150 °C. The material shows very good temperature cycle behaviour in the range from -50 °C to +140 °C and is resistant to vibrations. This results in minimum cracking even with thick-film applications. Bectron® PK 5542 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 5542 offers good adhesion on nearly all materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond. Fulfils the ROHS directive

Applications:
In cured state, Bectron® PK 5542 is a soft duroplastic which is suitable for protecting sensitive parts from chemicals, shock and vibration when these are exposed to high temperatures. Bectron® PK 5542 is used for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It can also be used as potting resin for electronic parts and sensors, automotive electronics, connectors etc. up to a temperature of 150 °C. It has moderate viscosity with slightly thixotropic properties and is suitable for selective thick film coating of components or for potting printed circuit boards or hybrids in housings.

One-component, UV-curing

Bectron® PT 4600

Bectron® PT 4600 is a polyurethane-based, solvent-free, one-component transparent material that is suitable for thick film coating. It is cured by UV light and moisture (for shadow zones). The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4600 offers outstanding insulation properties.

Properties:

  • Rapid UV curing
  • Moisture shadow curing
  • Temperature cycles from -40 °C to +120 °C
  • Temperature resistant from -40 °C +120 °C
  • Good flexibility down to -40 °C
  • Good adhesion
  • Good dielectric properties
  • Solvent-free
  • Low viscosity
  • Fulfils UL V0 (UL file no: E211569)

Applications:

  • Bectron® PT 4600 is VOC-free
  • For coatings with excellent electric performance, particularly suited for electronics and surface installation
  • Offers good protection from moisture, corrosion, migration and vibration

Bectron® PT 4601

Bectron® PT 4601 is a solvent-free, one-component, transparent polyurethane material that is suitable for thick film coatings. It is cured by UV light and moisture (for shadow zones). It has thixotropic properties for applications on selected areas on the printed circuit board. The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4601 offers excellent insulation properties.

Properties:

  • Rapid UV curing
  • Moisture curing in shadow zones
  • Temperature resistant from -40 °C +120 °C
  • Good flexibility down to -40 °C
  • Good adhesion
  • Good dielectric properties
  • Solvent-free
  • Thixotropic rheology

Applications:

  • Bectron® PT 4601 is VOC-free
  • For coatings with excellent electric performance
  • Offers good protection from moisture, corrosion, migration and vibration

Bectron® PT 4606

Bectron® PT 4606 is a solvent-free, one-component, transparent polyurethane material that is suitable for thick film coatings. It is cured by UV light and moisture (for shadow zones). It has thixotropic properties for applications on selected areas on the printed circuit board. Its high viscosity and thixotropic properties permit precise application on selected areas of the printed circuit board (e.g. suitable for sealing), for protecting parts or connections on the PCB or as dam for dam-and-fill applications.
The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4606 offers outstanding insulation properties.

Properties:

  • Rapid UV curing
  • Moisture curing in shadow zones
  • Temperature resistant from -40 °C +120 °C
  • Good flexibility down to -40 °C
  • Good adhesion
  • Good dielectric properties
  • Solvent-free
  • Highly thixotropic rheology

Applications:

  • Bectron® PT 4606 is VOC-free
  • For coatings with excellent electric performance
  • Offers good protection from moisture, corrosion, migration and vibration

Polyurethane two-component adhesives

Product details

Two-component polyurethane stands out with high structural strength and good ageing properties. It is resistant to UV and to the weather and is capable of bridging relatively large gaps. PUR 2C adhesive is suitable for large-surface bonding.

It is quick, easy and clean to process. WERNER WIRTH offers cold-flexible, crystal-clear and self-extinguishing 2C polyurethane.

2-component cold-flexible

Bectron® PB 3251

Bectron® PB 3251 with hardener Bectron® PH 4918 forms a two-component system for making an elastic compound that is suitable for potting. It is based on polybutadiene with polyurethane which is filled to warrant strength with flexibility at low temperatures and good resistance properties. It is resistant to organic and inorganic solvents. It is solvent-free and does not damage any components on the PCB.

Properties:

  • The cured material has high elasticity, flexibility and strength at low temperatures
  • Low glass transition temperature

Applications:

Bectron® PB 3251 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.

Bectron® PB 3252

Bectron® PB 3252 with hardener Bectron® PH 4916 is a two-component system that generates a flexible compound suitable for potting. It is based on polyurethane/polybutadiene and offers good flexibility at low temperatures and outstanding resistance properties. It is resistant to organic and inorganic solvents. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.

Properties:

  • The cured material has high elasticity and shows flexibility and strength at low temperatures.
  • Good electrical properties
  • Low glass transition temperature Tg (-55 °C)

Applications:

  • Bectron® PB 3252 is suitable for many potting applications that require stability toward thermal shock.
  • It is ideal for potting whole printed circuit boards when good protection is required from moisture, aggressive chemicals, jolts and vibrations.

Bectron® PB 3201

Bectron® PB 3201 with hardener Bectron® PH 4918 forms a two-component system that generates a flexible compound suitable for potting. Based on polyurethane/polybutadiene, it offers good flexibility at low temperatures. It is resistant to organic and inorganic solvents. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.

Properties:

  • The cured material offers high elasticity with flexibility and strength at low temperatures.
  • Good electrical properties
  • Low glass transition temperature Tg (-63 °C)
  • Fulfils the requirements of ROHS

Applications:

  • Bectron® PB 3201 is suitable for many potting applications that require stability toward thermal shock.
  • It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.

Bectron® PB 4540

Properties:

  • Two-component system with elastomer filling
  • Self-extinguishing
  • Very good electrical properties
  • Good thermal resistance
  • Low water absorption and moisture transfer
  • Good adhesion on glass, ceramics, plastics and metal
  • Good resistance to oil, grease and diesel fuel
  • The cured system is flexible even at very low temperatures
  • The system is UL 94 V-0-listed

Applications:

  • Encapsulating electrical and electronic components and printed circuit boards, particularly components that are sensitive to temperature
  • The high chemical resistance protects from moisture, alkaline and acidic environments.
  • Sealing

Bectron® PU 4515

Bectron® PU 4515 is a two-component liquid polyurethane system that is modified with polybutadiene. It has high flexibility and rubber-like properties, even at low temperatures. It is cured with the hardener Bectron® PH 4912. The system fulfils the requirements of ROHS.

Properties:

Elastic potting compound for mechanically sensitive electronic components and printed circuit board assemblies.

  • Potting compound with rubber-like properties
  • High temperature resistance up to 150 °C
  • Flexible to -60 °C
  • Low shrinkage
  • Good dielectric properties
  • Good adhesion
  • ROHS-compliant

Applications:

  • Bectron® PU 4515 offers excellent flexibility down to low temperatures and is suitable for use in devices used in a broad temperature range from -60 °C to + 150 °C
  • It is suitable used for potting sensitive components and printed circuit boards for outside use
  • The high chemical resistance protects from moisture, alkaline and acidic environments

Epoxy resin

Hard adhesive for firm bonds, e.g. of metal, and up to 180°C

Epoxy resin offers the best results for all materials with structural strength. Epoxy resin covers the temperature range up to 180°C, is very hard and has a very low expansion coefficient, which is ideal for bonding metal.

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Product details

The adhesive has one or two components, is free of solvents, does not develop any smell and stands out with good ageing properties. Epoxy resin is flame resistant, offers good thermal conductivity and is resistant. This adhesive cures at room temperature or by heating. Special epoxy resin can be cured with UV light.

One-component, heat-curing

These adhesives have one or two components, are free of solvents, do not develop any smell and stand out with good ageing properties. Epoxy resins are flame resistant, offer good thermal conductivity and are resistant. These adhesives cure at room temperature or by heating. Special epoxy resins can be cured with UV light.

Elan-glue® EP 5330

Properties:

  • Good adhesion on many substrates
  • Low shrinkage during curing
  • Resistant to moisture and migration
  • Resistant to organic and inorganic solvents
  • Solvent-free
  • Low thermal expansion
  • Good flowability
  • Rapid curing

Applications:

  • Elan-glue® EP 5330 is used as an adhesive for the chemical protection of parts (e.g. in microelectronic applications)
  • Ideal for warranting good protection from moisture and soiling on the printed circuit board and from mechanical jolts and vibrations

Elan-glue® EP 5620

Elan-glue® EP 5620 is a solvent-free one-component adhesive.

Properties:

  • Thermal curing
  • Fulfils the requirements of ROHS
  • VOC-free
  • Temperature resistant from -40 to 130 °C
  • Low viscosity

Applications:

  • For electronic applications

Elan-glue® EP 5340

Elan-glue® EP 5340 is an adhesive for heat management applications

Properties:

  • Excellent adhesion
  • High thermal conductivity
  • Low shrinkage during curing
  • Solvent-free
  • Resistant to moisture
  • Fulfils the requirements of ROHS

Applications:

  • Heat management applications

Elan-glue® EP 5350

Solvent-free one-component adhesive

Properties:

  • Low shrinkage during curing
  • Solvent-free
  • Good adhesion
  • High viscosity
  • Fulfils the requirements of ROHS

Applications:

Glass bonding, metal bonding

One-component, heat- and UV-curing

These adhesives have one or two components, are free of solvents, do not develop any smell and stand out with good ageing properties. Epoxy resins are flame resistant, offer good thermal conductivity and are resistant. These adhesives cure at room temperature or by heating. Special epoxy resins can be cured with UV light.

Elan-glue® EP 5610

Elan-glue® EP 5610 is a thermal/UV-curing one-component adhesive

Properties:

  • Thermal curing
  • UV-curing
  • Low shrinkage during curing
  • Excellent adhesion
  • Solvent-free
  • Fulfils the requirements of ROHS

Applications:

  • Printed circuit boards
  • Plastics
  • Metals

Elan-glue® EP 5611

Elan-glue® EP 5611 is a thermal/UV-curing one-component adhesive.

Properties:

  • Excellent adhesion on all common substrates
  • Resistant to temperature shocks
  • Low shrinkage during curing
  • Solvent-free
  • Fulfils the requirements of ROHS

Applications:

  • Chemical protection of metals
  • Metals
  • Plastics

Silicone

Adhesive with broad temperature range, perfect for electronic manufacturing

Silicone comes into play when epoxy, polyurethane and acrylic meet their temperature limits. Silicone is ideal for flexible use at low temperatures (-50°C) and also at up to 200 °C. It therefore offers the widest temperature range for its use.

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Product details

Silicone is usually quite soft (max. Shore A 60) and is available as coloured or colourless material, depending on requirements. Its adhesion properties can be further improved for example by thermal treatment.

One-component, condensation-crosslinking

Bectron® SA 70L1-30

Bectron® SA 70L1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • Self-levelling
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C 200 °C

Applications:

  • Installation and insulation of electronic and electric components and devices, sealing and bonding of parts sensitive to corrosion.

Bectron® SA 70P1-15

Bectron® SA 70P1-15 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • No slipping
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • Installation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

Bectron® SA 7OP1-30

Bectron® SA 7OP1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • Thixotropic
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • Installation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

Bectron® SA 70V1-36

Bectron® SA 70V1-36 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • Self-levelling
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • Installation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

One-component, heat-curing

Bectron® SC 76V1-36

Bectron® SC 76V1-36 is a translucent silicone that is suitable for coatings. It was specially developed to comply with the latest requirements in the electronics industry in terms of corrosion. It also offers outstanding dielectric properties and protection from moisture under adverse environmental conditions. Bectron® SC 76V1-36 is a one-component, condensation-crosslinking product (alkoxy) that does not cause the typical inhibition problems of addition-crosslinking systems. It also shows excellent adhesion on most common substrates used in the electronics industry.

Properties:

  • Rapid curing at room temperature
  • Good dielectric properties
  • Resistant to moisture and dust contamination
  • Resistant to weak acids and bases
  • Good adhesion on many substrates
  • Temperature resistant from -55 °C to 200 °C
  • Contains UV control trace pigment
  • Good edge coverage
  • Low volatile ingredients

Applications:

  • Coating electronics, e.g. PCBs, hybrids, SMD components, other individual components and consumer electronics.

Bectron® SA 70P1-15

Bectron® SA 70P1-15 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • No slipping
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • MoInstallation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

Bectron® SA 7OP1-30

Bectron® SA 7OP1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • Thixotropic
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • Installation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

Bectron® SA 70V1-36

Bectron® SA 70V1-36 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.

Properties:

  • Neutral curing
  • Good dielectric properties
  • Self-levelling
  • Good adhesion on most substrates
  • Temperature resistant from -55 °C +200 °C

Applications:

  • Installation of electric and electronic devices
  • Sealing and bonding devices sensitive to corrosion

Cyanoacrylate – instant adhesive

Versatile super-glue adhesives

Cyanoacrylate is a polymerising substance with outstanding adhesion to many different materials and surfaces. This fast-acting adhesive can truly be called super glue! But that by no means exhausts its many positive properties for sustainable component protection.

WERNER WIRTH offers a wide range of instant and super-glue adhesives with outstanding properties. Whether one- or two components, whether dual cure (contact and UV light) or supplementary cure boosters and adhesion primers, outstanding cyanoacrylate is the professional instant adhesive to make sure everything is in position promptly and permanently. On a wide range of materials and surfaces. Absolutely. And when we say super glue, we really mean a super adhesive that has nothing in common with the fast-acting glue you can buy at the DIY store.

Werner Wirth Komponentenschutz Kleber Bonding

Bostik Born2Bond™ super adhesive

The Bostik Born2Bond™ instant adhesive overcomes the application and performance barriers of previous instant adhesives with outstanding properties. The super adhesive cures instantly, it is low-odour and low-blooming so it remains transparent and does not turn white. Safe. Sustainable. Pioneering.

Product details

One-component instant adhesive – contact curing
One-component contact-curing instant adhesives in the WERNER WIRTH range are available in different viscosities, sizes and formats. From the 20 g bottle for manual dispensing via 500g containers for use with automatic dispensers and machines through to the practical gel in aluminium tubes (5g and 20g) for high-precision manual application.

Born2Bond™ ULTRA LV

Born2Bond™ ULTRA. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.

Properties:

  • Fixture time: 10 seconds*
  • High bonding strength
  • No special labelling (only in Europe)
  • Long open time
  • Low odour, low blooming
  • Less brittle than conventional instant adhesives
  • Bonds a large range of materials** including polystyrene
  • Transparent and easy to use

Applications:

  • Leather and rubber bonding
  • Shoe assembly
  • Automotive aftermarket applications
  • Speaker assembly

* depending on substrates. ** except polyolefins

Born2Bond™ ULTRA MV

Born2Bond™ ULTRA MV. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.

Properties:

  • Fixture time: 10 seconds*
  • High bonding strength
  • No special labelling (only in Europe)
  • Long open time
  • Low odour, low blooming
  • Less brittle than conventional instant adhesives
  • Bonds a large range of materials** including polystyrene
  • Transparent and easy to use

Applications:

  • Leather and rubber bonding
  • Shoe assembly
  • Automotive aftermarket applications
  • Speaker assembly

* depending on substrates. ** except polyolefins

 

Born2Bond™ ULTRA HV

Born2Bond™ ULTRA HV. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.

Properties:

  • Fixture time: 10 seconds*
  • High bonding strength
  • No special labelling (only in Europe)
  • Long open time
  • Low odour, low blooming
  • Less brittle than conventional instant adhesives
  • Bonds a large range of materials** including polystyrene
  • Transparent and easy to use

Applications:

  • Leather and rubber bonding
  • Shoe assembly
  • Automotive aftermarket applications
  • Speaker assembly

* depending on substrates. ** except polyolefins

Born2Bond™ ULTRA GEL

Born2Bond™ ULTRA GEL is a low-odour, low-blooming instant adhesive specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. The gel consistency permits application in every orientation. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.

Properties:

  • Fixture time: 5 seconds*
  • High bonding strength
  • No special labelling (only in Europe)
  • Long open time
  • Low odour, low blooming
  • Peel strength
  • Bonds a large range of materials** including polystyrene
  • Gel consistency for precise application

Applications:

  • Leather and rubber bonding
  • Shoe assembly
  • Automotive aftermarket applications
  • Sport equipment
  • Toy assembly

* depending on substrates. ** except polyolefins

Born2Bond™ LIGHT LOCK HV

Born2Bond™ LIGHT LOCK HV are low-odour, low-blooming, dual-curing (contact and light curing) cyanoacrylate adhesives. They are ideal for instant bonding or coating. Their sensitivity to UV light and visible light allows rapid bonding through transparent parts and quick curing of light-exposed areas or coated surfaces, while the bonding capability ensures cure between opaque substrates (contact cure).

Properties:

  • Dual cure formulation: contact and light curing
  • Fixture time of 60 seconds without light exposure and 5 seconds with light curing
  • Can be cured with visible and UV-LED light
  • Long open time without activation
  • Dry to touch, tack free surface cure
  • Cure-on-demand of excess material released from bond lines
  • Bonds, fills, reconstructs and coats
  • Low odour, low blooming

Applications:

  • Conformal coating for printed circuit boards
  • Encapsulation
  • Electronics assembly
  • Plastic, metal and glass bonding

* depending on substrates ** except polyolefins

Born2Bond™ LIGHT LOCK GEL

Born2Bond™ LIGHT LOCK GEL are low-odour, low-blooming, dual-curing (contact and light curing) cyanoacrylate adhesives. They are ideal for instant bonding or coating. Their sensitivity to UV light and visible light allows rapid bonding through transparent parts and quick curing of light-exposed areas or coated surfaces, while the bonding capability ensures cure between opaque substrates (contact cure).

Properties:

  • Dual cure formulation: contact and light curing
  • Fixture time of 60 seconds without light exposure ant 5 seconds with light curing
  • Can be cured with visible and UV-LED light
  • Long open time without activation
  • Dry to touch, tack free surface cure
  • Cure-on-demand of excess material released from bond lines
  • Bonds, fills, reconstructs and coats
  • Low odour, low blooming
  • Available in different viscosities: HV and GEL

Applications:

  • Conformal coating for printed circuit boards
  • Encapsulation
  • Electronics assembly
  • Plastic, metal and glass bonding

Product details

Two-component super adhesive: syringes and handguns
The two-component (2C) super adhesives in the WERNER WIRTH range are available in 10 g syringes for manual application and in 50 g syringes for use with dispensing handguns. Both products are compatible with static disposable mixers.

Born2Bond™ FLEX

Born2Bond™ FLEX is a flexible, elastic and low-odour instant adhesive with exceptional adhesion to a very broad range of materials and surfaces. It has a curing time of six minutes and becomes a polymer with more than 200% elongation in up to 10 minutes. It can be used for filling larger gaps and achieves instant adhesion to most plastics, woods and metals as well as to porous and irregular surfaces.

Properties:

  • Cures in 5– 10 minutes*
  • Elongation > 200%
  • No special labelling (only in Europe)
  • Absorbs jolts and vibrations
  • High peel strength
  • Bonds a large range of materials** including glass
  • Transparent, low odour, low blooming
  • Gel consistency for precise application
  • Non-sagging for vertical applications

Applications:

  • Leather bonding
  • Sealing repair
  • Elastic seam sealing
  • Flooring and panel bonding
  • Vibration dampening
  • Glass and rubber bonding

*Depending on gaps and substrates. ** except polyolefins

Born2Bond™ STRUCTURAL

Born2Bond™ STRUCTURAL is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bonding gaps up to 5mm. This product offers excellent bonding properties to a large variety of closed substrates, such as aluminium, plastics and elastomers as well as porous substrates such as woods, chipboard and leather. Born2Bond™ STRUCTURAL is formulated for applications that require mechanical and in-use environmental resistance.

Properties:

  • Fixture time in 30 seconds*
  • High adhesion strength: >6 MPa after 5 minutes
  • Open time: 25 minutes
  • Fills gaps up to 5 mm
  • Excellent adhesion on various substrates**
  • Transparent when cured
  • Temperature and humidity resistance
  • Gel consistency for precise application

Applications:

  • Structural bonding
  • Metal bonding, e.g. aluminium and magnet
  • Plastic, elastomer and glass bonding

*Depending on gaps and substrates. ** except polyolefins

Born2Bond™ REPAIR

Born2Bond™ REPAIR is a gap-filling instant adhesive and repair product with excellent adhesion to a very broad range of materials. Repair is ideal for instant bonding and repairing because it combines the strength of a structural adhesive with the speed of an instant adhesive. A tough polymer is achieved within a curing time of under 10 minutes. The gel consistency permits application in every orientation

Properties:

  • Fixture time in 60 seconds*
  • Cures in 5– 10 minutes*
  • Instant adhesion with high strength
  • Low shrinkage: 4.3 %
  • Fills gaps of all volumes
  • Bonds a large range of materials**
  • Machinable, sandable and paintable once cured
  • Impact resistant
  • Gel consistency for precise application
  • Non-sagging for vertical applications

Applications:

  • Automotive aftermarket applications
  • Wood repair and reconstruction
  • Rubber bonding
  • Plastic defect repairing

*Depending on gaps and substrates. ** except polyolefins

Product details

Boosters and primers: the adhesion catalysts
The performance catalysts in WERNER WIRTH’s cyanoacrylate range guarantee the required results even under difficult prerequisites. Boosters (bond activator) accelerate the curing of adhesives when time is at a premium. Primers (adhesion agent) create a bonding layer between material and adhesive, ensuring optimum adhesion properties and excellent bonding even on surfaces with extremely poor adhesive properties.

Born2Bond™ BOOSTER

Born2Bond™ BOOSTER is a surface preparation product that accelerates the curing of cyanoacrylate. It was designed specifically for curing on acidic surfaces, such as wood, and on porous surfaces. The long open time and short drying time make it the ideal choice for professionals. In contrast to other boosters, Born2Bond™ BOOSTER is ideal particularly for boosting fast adhesion when bonding parts exposed to direct high loads, such as edge coating or shoe soles.

Properties:

  • Boosts the curing speed of cyanoacrylate adhesives on acidic wood and porous substrates
  • Dries in seconds
  • Long open time: 24 hours
  • Transparent

Applications:

  • Surface preparation
  • Accelerates the bonding of wood, leather and vertical surfaces

Born2Bond™ PRIMER

Born2Bond™ PRIMER is used to improve the bonding of polyolefins and other low surface-energy substrates with cyanoacrylate adhesives. It is only recommended for substrates that are difficult to bond, such as polyethylene, polypropylene, polytetrafluorethylene (PTFE) and thermoplastic rubber materials. Born2Bond™ PRIMER is not recommended for applications with high peel strength.

Properties:

  • Improves adhesion to substrates that are difficult to bond
  • Specially formulated for bonding polyolefins
  • Suitable for other cyanoacrylates
  • Dries in seconds
  • Increases bond strength
  • Very low viscosity

Applications:

  • Surface preparation
  • Adhering plastics and polyolefins that are difficult to bond
CONTACT

Send us your message. We are here for you personally.

Do you have questions about various adhesives, or would you like to have a conversation with us?

Feel free to use our contact form or give me a call: +49 40 75 24 9165.

We look forward to exchanging thoughts with you.

Sincerely,
Dr. Maria Speiser

Werner Wirth Team Dr. Maria Speiser