Werner Wirth Systems GmbH

Two tried-and-tested procedures may be selected for the conformal coating of flat electronic modules:

The thick-film procedure, through the dam-and-fill process, offers partial protection for larger printed circuit boards or individual devices. The thicker coating, through its relative elasticity, ensures strong protection even in the event of high temperature changes.

A very thin protective layer is applied onto the assembled printed circuit boards during the thin-film procedure by means of spray or immersion technology. As a result sensitive circuitry may be protected with full or partial efficiency.

For the thin-film procedure we recommend exclusively thermal or UV hardening 1K polyurethane varnish and pasty materials from the BECTRON® range, which are available for both hardening procedures in different viscosities.

Adjusted viscosity and fast hardening procedures ensure the economic efficiency of your production process. Environmental friendliness in production and application is naturally assured.


Examples of application:

• Solely partial or full coating of printed circuit boards assembling

BECTRON® Thickfilm Coating Matrix

1. Thin film
2. Thick film Thermal curing thick film varnishes
3. Thick film Moisture cross-linking and UV curing thick film varnishes